MediaTek Unveils Premium Smartphone Chips for Redmi, OnePlus and Oppo

MediaTek Unveils Premium Smartphone Chips for Redmi, OnePlus and Oppo

Qualcomm and MediaTek look to be gearing up for a showdown in the semiconductor industry. To compete with Qualcomm’s high-end products, MediaTek has announced the Dimensity 8000 and 8100, with the Dimensity 9000 already knocking Qualcomm out of the flagship class.

Despite the fact that they are both 5 nm processors built on nearly the same technology, the Dimensity 8100 has faster clock speeds than the 8000. MediaTek also revealed the Dimensity 1300, a minor upgrade to the previous Dimensity 1200 processor.

Four large Cortex-A78 CPU cores and four little A55 CPU cores are found on the two 8000 chips. In this scenario, the GPU is a Mali-G610 MC6, which is based on ARM’s newest GPU architecture.

The Dimensity 8100, in comparison to the 8000, is touted to feature a 20% higher GPU frequency and a 25% higher CPU power efficiency than previous generation Dimensity CPUs. The 8100 hit 170 frames per second on GFXBench Manhattan offscreen, while the 8000 stayed at 140.

MiraVision 780 technology is built into both CPUs, allowing for a 168 Hz refresh rate at Full HD+ quality. The 8100 SoC features a 120Hz refresh rate at WQHD+, which is a remarkable feature. Both chips, on the other hand, include 4K AV1 video decoders and HDR10+ Adaptive compatibility, which allows HDR10+ content to be adjusted to ambient light conditions.

It also comes with the Imagiq 780 image signal processor, which can handle 5 gigapixels per second and record HDR footage from two cameras at the same time, as well as 4K 60 fps HDR10+ recording from one camera. This ISP can handle cameras with up to 200 MP sensors and natively offers 2x lossless zoom and AI-powered noise reduction, in addition to HDR imaging.

Both chipsets have 5G modems with carrier aggregation up to 200 MHz, allowing for download speeds of up to 4.7 Gbps. Dual SIM (5G+5G) and Dual Standby (5G+5G) are supported by the modem.

The Dimensity 1300 is almost identical to the Dimensity 1200, which was released previously. The sole difference is the improved NPU performance, which gives increased computing capabilities for night mode and HDR processing with AI. It runs on MediaTek’s HyperEngine 5.0 and can support cameras with up to 200 megapixels. The chip also supports NavIC, Wi-Fi 6E, and Bluetooth 5.3.

Following the official release of the Dimensity 1300, 8000, and 8100 chipsets, Redmi, Oppo, and Oneplus have all announced smartphones that will utilise them.

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